Multi-layer PCB was made up of more than two electrical layers (copper layers) superimposed on each other. The copper layers are bonded together by a thickness of insulating material called prepreg. Prepreg is B stage epoxy impregnated fiberglass. The need for multi-layer PCB has been necessitated by the increasing packaging density of integrated circuits, which give rise to high concentration of interconnecting lines.
Quality: IPC-A-600H (Class 2) |
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